1. Educational requirements:
1. Bachelor's degree from a double first-class university, majoring in electronic information, communications engineering, information engineering, etc., is preferred.
2. Master's degree from a key national university (985/211), majoring in Electrical Circuits and Systems, Microelectronics, etc.
II. Professional skills requirements:
1. Proficient in the design principles and methods of RF chips, familiar with the design of RF circuits under 5G, 4G, 3G and other communication standards, and familiar with the characteristics of various chip materials such as GaAs and CMOS and their application in RF circuits.
2. Master the full chip design process, including product planning, substrate layout, digital, analog and RF circuit design, component selection, etc. key stages, and be able to use professional design software such as ADS, Cadence, HFSS, innovus, etc. to design and simulate circuits.
3. Understand embedded system development knowledge, familiar with hardware design, software coding and system transplantation technologies, and able to collaborate with embedded system engineers to complete chip and system integration.
Three. Work experience requirements:
1. More than 10 years of experience in chip design or related fields, with experience in PA design for mobile phone RF chips.
3. Candidates with work experience in well-known semiconductor companies are preferred (such as Spreadtrum (formerly RDA Microelectronics), Qualcomm, MediaTek, Huawei Hisilicon and other industry leaders), familiar with the company's chip design and development process, project management mode, and able to quickly adapt to the new work environment and project requirements.
Four. Project experience requirements:
