1. Educational requirements:
1. Bachelor's degree from a double first-class university, majoring in electronic information, communications engineering, information engineering, etc., is preferred.
2. Master's degree from a key national university (985/211), majoring in circuits and systems, microelectronics, etc.
II. Professional skills requirements:
1. Proficient in the design principles and methods of RF chips, familiar with the design of RF circuits under 5G, 4G, 3G communication standards, and familiar with the characteristics of various chip materials such as GaAs and CMOS and their applications in RF circuits.
2. Master the full chip design process, including product planning, substrate layout, digital, analog and RF circuit design, component selection, etc. key stages, and be able to use professional design software such as ADS, Cadence, HFSS, innovus, etc. for circuit design and simulation.
3. Understand embedded system development knowledge, familiar with hardware design, software code and system transplantation technologies, and able to collaborate with embedded system engineers to complete chip and system integration.
Three,Work experience requirements:
1. Have more than 10 years of experience in chip design or related fields, with experience in mobile phone RF chip PA design.
3. Candidates with work experience in well-known semiconductor companies are preferred (such as Spreadtrum (formerly RDA Microelectronics), Qualcomm, MediaTek, Huawei Hisilicon and other industry leaders), familiar with the company's chip design and development process, project management mode, and able to quickly adapt to the new work environment and project requirements.
Four.Project experience requirements:
