Device R&D Engineer

香港阜时科技有限公司·Electronics / Electrical Equipment

HK work permit required
3 to 5 yrs exp
Master
5 days per week, Fixed
HK $30K-60K/Month
Job Highlights
负责先进光电器件研发
需211硕士及以上学历
精通TCAD、FDTD仿真工具
Job benefits
Double Pay
Year-end bonus
Compassionate leave
Marriage leave
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Job Description

This position can be based in the West Lake District of Nanshan District, Shenzhen.

Duties:

1. Responsible for the development of silicon-based single-photon avalanche diode (e.g. SPAD, SiPM) device process, structure and characterization methods;

2. Responsible for device and pixel-level process, electrical, optical simulation and modeling work, quantifying performance indicators;

3. Participate in experiment design, and improve and iterate device design;

4. Research advanced characterization techniques for devices and promote the implementation of characterization schemes;

5. Keep up with the latest photonic and electronic device technologies, participate in project pre-research;

Requirements:

1. Master's degree or above, with 3 to 5 years or above of CMOS SPAD/SiPM device or CIS device pixel design experience (with complete design and fabrication experience preferred);

2. Proficient in semiconductor device simulation tools such as TCAD, FDTD, etc.;

3. Proficient in using Python or MATLAB programming language for data processing;

4. Familiar with semiconductor physics, solid-state physics, CMOS semiconductor process, optoelectronic devices, microelectronics, optics, materials and other related professional basic knowledge;

5. English proficiency of level four or above, listening, reading and writing are fluent without difficulty;

6. Able to use Word, Excel, PPT, etc., office and drawing software fluently;

7. Enjoy communication, good at team work, strong sense of responsibility and subjective initiative;

View more
Electrical Installation
Electronics Engineering
Electrical Engineer
English
Mandarin
Miss Li
HK Fulltime Technology Co., Ltd.·HR
Company Overview
Hong Kong Future Science and Technology Co., Ltd. is a subsidiary of Shenzhen Future Science and Technology Co., Ltd., and Future Science and Technology specializes in the design of laser radar SPAD chips, and is a unicorn company poised for an IPO. Its headquarters is located in Shenzhen, China, and it is an integrated circuit design company, a national high-tech enterprise, and the Guangdong Province Human-Computer Interaction Sensor Engineering Technology Research Center. As of now, it has applied for 776 intellectual property rights and been authorized for 397, covering SPAD chips and laser radar fields. Future Science and Technology has created many world records: the world's first under-screen color temperature chip is exclusively mass-produced in a first-line mobile phone brand flagship; the 3D visual product has the largest shipment volume in the smart lock industry; and the LCD under-screen fingerprint chip is globally launched.
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