1. Lead the design of silicon light or thin-film niobium pentoxide chip core modules, covering the entire process from RTL design and simulation verification to physical implementation, ensuring that the design solution meets the product performance, cost and mass production requirements.
3. In-depth understanding of chip architecture, leading technology solution formulation and decision-making, and conducting intensive attacks on complex technical problems in the design process to ensure project progress.
4. Build chip design stage technical specifications and process standards, using a "one-to-one" mentoring mode to guide assistant engineers, lead the team to complete design tasks, and inherit technical experience.
5. Collaborate with cross-functional teams such as chip manufacturing and packaging to provide design-side technical support and ensure design compatibility with subsequent process steps.
Job Requirements
1. Bachelor's degree or above, majoring in microelectronics, integrated circuits, electronic information engineering, etc., with a preference for master's degrees/doctorates.
2.5 years or more of silicon photonics or thin-film lithium niobate chip design related work experience, with mature chip production project full process participation experience.
3. Proficient in Ansys/Comsol and other simulation programs, familiar with Cadence/Synopsys and other EDA tools, and with solid skills in analog/digital chip design.
4. Have a deep understanding of chip architecture, be able to independently complete core module design, timing analysis and complex problem troubleshooting, and have the ability to lead the formulation of technical solutions.
Working location
Hong Kong / Hangzhou, China (optional), company name: Xi Li Optoelectronic Technology (Hangzhou) Co., Ltd.
Salary: This is a core position in the company, salary negotiable, and determined based on personal abilities!
