Hardware Engineering Intern

CAIR, HKISI, CAS·Others

Part TimeInternshipFull Time
HK work visa available
Less than 1 year exp
Bachelor
9.0 hrs/day, 5 days/wk
HK $18K-23K/Month
Job Highlights
支持多臂手术机器人项目
熟练使用PCB设计工具
电子信息工程相关专业要求
Job Description

Job Description:

The position is responsible for PCB design, harness welding, endoscope assembly, etc. Hardware development related work, support multi-arm surgical robot project hardware development work.

Duties:

1. Assist in completing PCB design, including schematic design and PCB layout, wiring;

2. Perform welding, debugging and hardware repair to ensure the normal operation of the circuit board;

3. Assist the R&D team in completing the writing and archiving of hardware design documents;

4. Collaborate with the team to complete other hardware-related support work.

Requirements:

1. Electronic information engineering, communication engineering and other related professional, bachelor's degree or above, during the internship period, at least 3 days a week to ensure attendance;

2. Proficient in at least one PCB design tool (such as Altium Designer, KiCAD, OrCAD, etc.);

View more
Technical Skills
Mechanical Engineering
Power Distribution
English
Mandarin
Jun Xu
CAIR, HKISI, CAS·Senior BD Manager
Company Overview
The Chinese Academy of Sciences Hong Kong Science and Innovation Research Institute Artificial Intelligence and Robotics Center (CAIR) was established in 2019 and is the first innovation center established by the Chinese Academy of Sciences in Hong Kong. It is also one of the 14 InnoHK centers. CAIR focuses on brain-like artificial intelligence theory, multimodal large-scale AI models and artificial intelligence-driven robotics technology, aiming to become an international research and innovation hub with far-reaching influence on the Guangdong-Hong Kong-Macau Greater Bay Area and the world. The center's main application areas are medical and life sciences, and its research results cover the CARES Copilot 2.0 multimodal surgical large model, flexible surgical robots, intelligent sports assistance technology and human-robot interaction technology. CAIR is committed to promoting the development of medical robots and artificial intelligence technology with its innovative artificial intelligence and robotics technology, and hopes to make major contributions to the medical and life sciences field. The Chinese Academy of Sciences Hong Kong Innovation and Technology Center for Artificial Intelligence and Robotics (CAIR), established in 2019, is the first innovation center set up by the Chinese Academy of Sciences in Hong Kong, also one of the 14 InnoHK centers. Focused on neuromorphic AI theory, multimodal large-scale AI models, and robotics driven by artificial intelligence, CAIR aims to become an international research and innovation hub with profound impacts on the Guangdong-Hong Kong-Macao Greater Bay Area and globally. Its main application fields include healthcare and life sciences, covering multi-modal surgical large models such as CARES Copilot 2.0, flexible surgical robots, intelligent movement-assistance technologies, and human-robot interaction technologies. With its innovative AI and robotics technology, CAIR strives to drive the development of medical robotics and AI technology, hoping to make significant contributions to the healthcare and life science sectors.
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