Algorithm Expert/Engineer (part-time)

Hong Kong Future Science and Technology Co., Ltd. is a subsidiary of Shenzhen Future Science and Technology Co., Ltd., and Future Science and Technology specializes in the design of laser radar SPAD chips, and is a unicorn company poised for an IPO. Its headquarters is located in Shenzhen, China, and it is an integrated circuit design company, a national high-tech enterprise, and the Guangdong Province Human-Computer Interaction Sensor Engineering Technology Research Center. As of now, it has applied for 776 intellectual property rights and been authorized for 397, covering SPAD chips and laser radar fields. Future Science and Technology has created many world records: the world's first under-screen color temperature chip is exclusively mass-produced in a first-line mobile phone brand flagship; the 3D visual product has the largest shipment volume in the smart lock industry; and the LCD under-screen fingerprint chip is globally launched.