Digital IC Design Engineer (Full-time)

香港阜时科技有限公司·Electronics / Electrical Equipment

HongKong
HK work permit required
5 to 10 yrs exp
Bachelor
HK $30K-60K/Month
Job Highlights
16薪
Job Description

This position can be based in Shanghai or Shenzhen, with a 16-month salary

Duties:

  1. According to system requirements, define chip specifications and set the performance requirements for each module;

  2. According to the chip specifications, develop a digital overall solution;

  3. Digital algorithm building and simulation;

  4. Digital circuit design and verification document, application instructions document writing;

  5. Guide digital backend APR layout generation, assist application testing and mass production testing.

Requirements:

1. Bachelor's degree or above, majoring in microelectronics, integrated circuit design, automation, computers, and physics;

2. More than 5 years of relevant experience, those who have experience in CPU/MCU, digital image processing, and neural network acceleration chip design and development are preferred;

  1. Proficient in Verilog RTL code writing and verification, familiar with common digital circuit design tools;

  2. Familiar with the digital circuit design process and methods, familiar with the integrated circuit manufacturing process;

  3. Have good digital signal processing fundamentals, have some understanding of digital front-end design methods such as logic synthesis, timing analysis, and formal verification;

  4. Strong work ethic, good communication and expression skills, and team spirit.

View more
verilog
CPU
MCU
RTL
Mandarin
Miss Li
HK Fulltime Technology Co., Ltd.·HR
Company Overview
Hong Kong Future Science and Technology Co., Ltd. is a subsidiary of Shenzhen Future Science and Technology Co., Ltd., and Future Science and Technology specializes in the design of laser radar SPAD chips, and is a unicorn company poised for an IPO. Its headquarters is located in Shenzhen, China, and it is an integrated circuit design company, a national high-tech enterprise, and the Guangdong Province Human-Computer Interaction Sensor Engineering Technology Research Center. As of now, it has applied for 776 intellectual property rights and been authorized for 397, covering SPAD chips and laser radar fields. Future Science and Technology has created many world records: the world's first under-screen color temperature chip is exclusively mass-produced in a first-line mobile phone brand flagship; the 3D visual product has the largest shipment volume in the smart lock industry; and the LCD under-screen fingerprint chip is globally launched.
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